기술자료

Minimum Line / Space
Unit : ㎛
기술자료
Method Condition(Thk) Normal Special MSAP (TEST) Remark
Base Cu Plated Cu
CCL Half
Etching
6 8 50/50 40/40 35/35 Double Sided
Via Hole (Diameter of Hole/Pad)
Unit : mm
Via Hole (Diameter of Hole/Pad)
Conditions 2016 2017 2018 Remark
FPCB Via hole Tool
D/S PTH Bit 0.12/0.32 0.11/0.3 0.10/0.29 *0.1Under:Laser
PTH Laser 0.035/0.2 0.030/0.19 0.025/0.19
MLB PTH Bit 0.125/0.32 0.12/0.3 0.11/0.29
BVH Laser 0.12/0.32 0.11/0.31 0.10/0.30 A-Ratio : Under 0.8
IVH Same as Double Sided  
Super Thin FPCB ( Double Sided )
Specifications
Unit : ㎛
기술자료
층수 재료 두께
양면 C/L Film 7.5
접착제 15
동도금 (Cu Plating) 8
CCL Copper 6
접착제 -
Base Film 12
접착제 -
Copper 6
동도금 (Cu Plating) 8
C/L 접착제 15
Film 7.5
전체두께 85
Thickness Plan( Double Sided )
Unit : ㎛
기술자료
구분 2016 2017 2018
FCCL
(Double)
09-12-09 06-12-06 06-09-06
Coverlay
(Ad+PI)
15-7.5 10-7.5 10-5
Total 85 75 67
Super Thin FPCB ( Multi Layer )
Specifications-3Layer
Unit : ㎛
기술자료
층수 재료 두께
1L C/L Film 7.5
접착제 20
동도금 (Cu Plating) 15
1-2L CCL Copper 9
Base Film 12
Copper 9
층간접착제 Bonding (아크릴에폭시) 12.5
3L CCL Base Film 12
Copper 9
동도금 (Cu Plating) 15
3L C/L 접착제 20
Film 7.5
전체두께 148.5
Thickness Plan
Unit : ㎛
기술자료
구분 2016 2017 2018
FCCL
(Double)
09-12-09 06-12-06 06-09-06
FCCL
(Single)
09-12-00 06-12-00 06-09-00
Coverlay
(Ad+PI)
20-7.5 15-7.5 15-5
Total 148.5 129.5 118.5
Surface Treatment
Unit : ㎛G = General , S = Special
기술자료
Items Specifications Applications Remarks
Hard Ni/Au
(Electrolytic)
Case 1 - Ni: 3~8 / Au: min. 0.05 (G)
Case 2 - Ni: 3~8 / Au: min. 0.1 (S)
Physical Contact Area
(ex. Connector, Dial, Dome)
Soldering (SMT)
Available

in Our

Own

Equipment
Soft Ni/Au
(Electrolytic)
Case 1 - Ni: 5~11/ Au: min. 0.5 (G)
Case 2 - Ni: 1~3 / Au: min. 0.03
Wire Bonding
Filp Chip
Direct Au
(Electrolytic)
Au: min.0.5(G)
Connector(Crack-Proof)
Soldering(SMT)
ENIG
(Electro-less)
Case 1 - Ni: 3~7 / Au: min. 0.03(G)
Case 2 - Ni: 1~3 / Au: min. 0.03
Soldering (SMT)
Direct Interconnect (ACF)
Connector (Crack-Proof)
OSP 0.3±0.2 ㎛ (G) Soldering (SMT)
ENEPIG
(Electro-less)
Case 1
Ni: 3~9 / Pd: min 0.05 / Au: min. 0.03
Case 2
Ni: 3~9 / Pd: 0.08∼0.20 /Au: 0.08∼0.20
Soldering (SMT)

Wire Bonding